
Fold It.

Roll It.

What will you make with Kolon CPI™ films?
Benefits

High clarity, colorless

High-temperature stability

Excellent surface hardness

Smooth surface

Acid and solvent tolerant

Effective moisture barrier

Radiation tolerant
Applications
- Flexible, foldable, or rollable displays
- Organic light-emitting diodes (OLEDs)
- Liquid crystal displays (LCDs)
- Organic photovoltaics (OPVs)
- Flexible printed circuit boards (FPCBs)
- Semiconductors
- Electrostatic dissipative coatings (e.g., for fighter jets)
- Electromagnetic interference (EMI) shielding
- Solar sails
- Space antennas
- Fresnel lenses
- Reflectors



What makes Kolon’s CPI™ material the better choice?
- Colorless
- Capable of high-temperature processing
- Ideal polyimide film substrate properties
- Ideal flexible substrate properties
- No UV curing needed
The colorless quality of Kolon’s CPI™ material makes it the only polyimide that can be used for flexible, transparent substrates while offering superior mechanical properties.
Most available polymers are limited in this area—allowing for processing only up to 180 °C. Kolon’s CPI™ material performs better, offering a glass-transition temperature greater than 300 °C. This makes the material very well suited to conventional, high-temperature processing techniques.
With both superior surface hardness and ultra-smoothness, Kolon’s material meets or exceeds surface roughness and moisture absorption requirements for
Kolon’s CPI™ material offers the capability for roll-to-roll processing along with flexural endurance and a low dissipation factor—all qualities that provide superior performance for use as a flexible substrate.
Solar-based applications are hot, and materials to accommodate them need to be able to take the heat. While many substrates require an addition step of ultraviolet (UV) curing for these applications, Kolon’s CPI™ material is ideal for OPVs and other solar products.
Colorless
The colorless quality of Kolon’s CPI™ material makes it the only polyimide that can be used for flexible, transparent substrates while offering superior mechanical properties.
Capable of high-temperature processing
Most available polymers are limited in this area—allowing for processing only up to 180 °C. Kolon’s CPI™ material performs better, offering a glass-transition temperature greater than 300 °C. This makes the material very well suited to conventional, high-temperature processing techniques.
Ideal polyimide film substrate properties
With both superior surface hardness and ultra-smoothness, Kolon’s material meets or exceeds surface roughness and moisture absorption requirements for
Ideal flexible substrate properties
Kolon’s CPI™ material offers the capability for roll-to-roll processing along with flexural endurance and a low dissipation factor—all qualities that provide superior performance for use as a flexible substrate.
No UV curing needed
Solar-based applications are hot, and materials to accommodate them need to be able to take the heat. While many substrates require an addition step of ultraviolet (UV) curing for these applications, Kolon’s CPI™ material is ideal for OPVs and other solar products.
Specifications
- Kolon’s CPI™Compared to Conventional Optical Film
- Kolon’s CPI™ Bare Films
- Kolon’s CPI™ Film with HardCoating
- Kolon’s CPI™ Varnish
Unit | Glass | PI | CPITM | PET | PC | COC | |
---|---|---|---|---|---|---|---|
Tg | °C | >450 | >400 | >330 | 80 | 145 | 150 |
CTE (50∽250°C) | ppm/°C | 0.8 | <25 | 11 | 30∽40 (50∽100°C) | 80 (50∽100°C) | 95 (50∽100°C) |
TT | % | 92 | <60 | 90 | 91 | 90 | 90 |
Yellow Index | - | 0 | >90 | 2.0 | 0.2 | 0.5 | 0.3 |
Rth | nm | - | >2,000 | 300 (Improving) | 800 | 90 | 7 |
Flexibility | - | Brittle | Excellent | Excellent | Good | Brittle | Brittle |
Surface Hardness | - | 9H | - | 2H | 2B | B | HB∽F |
Modulus | GPa | 10 | >3 | >6 | 3 | 2 | 2 |
Water Absorption (23°C/24hrs) | % | 0 | 2∽3 | <1 | 1.2 | 0.2 | 0.02 |
Kolon's CPITM Bare Films
Grade 1 | Grade 2 | Grade 3 | Grade 4 | |
---|---|---|---|---|
Thickness (μm) | 30 | 30 | 20 | 20 |
Transmittance (%) (@380~780nm) | 88 | 90 | 89 | 88 |
Yellow Index | <4.5 | 0.7 | 1.8 | 2.9 |
CTE(ppm/°C)(@50~250°C (2nd)) | 10 | 11 | 28 | 45 |
Tg (°C) | >330 | 335 | 300~320 | 300~320 |
Td1wt% (°C) | >470 | 473 | >450 | >450 |
Surface Hardness | 1H | 2H | >1H | 1H |
Tensile Strength (MPa) | >300 | 310 | 167 | 132 |
Elongation (%) | <35 | 32 | 30 | 29 |
Modulus (GPa) | >6 | 6.2 | 5.3 | 4.5 |
Dielectric Constant (@10GHz) | <3.5 | <3.5 | <3.5 | <3.5 |
Potential Application | TFT Substrate | Cover Window | TSP Substrate | FPCB |
High Flexibility Type | High Hardness Type | |||
---|---|---|---|---|
1-Side H/C (50/10) | Both-Side H/C (10/50/5) | 1-Side H/C (5-/20) | ||
CPI Fill Thickness (μm) | 50 | |||
Hard Coating Thickness (μm) | 10 | 10 / 5 | 20 | |
Transmittance (%) | 91.0 | 91.0 | 91.0 | |
Yellow Index | 0.6 | 1.6 | 0.6 | |
Surface Hardness (750gf) | 7H | 7H | 8H | |
Adhesion (Cross Cut Test) | 100/100 | 100/100 | 100/100 | |
Scratch Text (#0000, 1kg, 500Times) | PASS | PASS | PASS | |
Static | In Folding Radius (mm) | 1 | 2 | 1 |
Out Folding Radius (mm) | 2 | 2.5 | 3 | |
Dynamic | Folding Test | Both-Side (3R x 150,000) | Both-Side (3R x 150,000) | Coating-Side (3R x 150,000) |
Grade 5 | Grade 6 | |
---|---|---|
Solid Content (wt%) | 13~14 | 12~15 |
Solid Viscosity (ps) | 50~100 | 50~100 |
Thickness (μm) | 10 | 10 |
Yellow Index | 12.0 | 6.3 |
Transmittance (%) (@550nm) | 86.4 | 88.2 |
Rth(nm) | - | 102 |
Tg (°C) | 385 | 320 |
Td 1% (°C) | 527 | 396 |
CTE(ppm/°C)(1st/2nd Value) | 6.3/7.9 (@50~380°C) | 26.9/35.1 (@50~250°C) |
Tensile Strength (MPa) | 225 | 147 |
Elongation (%) | 20.7 | 8.5 |
Modulus (GPa) | 5.4 | 5.2 |
Chemical Resistance (DMAc, NMP) | 0 | 0 |
Potential Application | TFT Substrate | TSP Substrate |
Kolon’s CPI™Compared to Conventional Optical Film
Unit | Glass | PI | CPI™ | PET | PC | COC | |
---|---|---|---|---|---|---|---|
Tg | °C | >450 | >400 | >330 | 80 | 145 | 150 |
CTE (50∽250°C) | ppm/°C | 0.8 | <25 | 11 | 30∽40 (50∽100°C) | 80 (50∽100°C) | 95 (50∽100°C) |
TT | % | 92 | <60 | 90 | 91 | 90 | 90 |
Yellow Index | – | 0 | >90 | 2.0 | 0.2 | 0.5 | 0.3 |
Rth | nm | – | >2,000 | 300 (Improving) | 800 | 90 | 7 |
Flexibility | – | Brittle | Excellent | Excellent | Good | Brittle | Brittle |
Surface Hardness | – | 9H | – | 2H | 2B | B | HB∽F |
Modulus | GPa | 10 | >3 | >6 | 3 | 2 | 2 |
Water Absorption (23°C/24hrs) |
% | 0 | 2∽3 | <1 | 1.2 | 0.2 | 0.02 |
Kolon's CPI™ Bare Films
Grade 1 | Grade 2 | Grade 3 | Grade 4 | |
---|---|---|---|---|
Thickness (μm) | 30 | 30 | 20 | 20 |
Transmittance (%) (@380~780nm) | 88 | 90 | 89 | 88 |
Yellow Index | <4.5 | 0.7 | 1.8 | 2.9 |
CTE(ppm/°C)(@50~250°C (2nd)) | 10 | 11 | 28 | 45 |
Tg (°C) | >330 | 335 | 300~320 | 300~320 |
Td1wt% (°C) | >470 | 473 | >450 | >450 |
Surface Hardness | 1H | 2H | >1H | 1H |
Tensile Strength (MPa) | >300 | 310 | 167 | 132 |
Elongation (%) | <35 | 32 | 30 | 29 |
Modulus (GPa) | >6 | 6.2 | 5.3 | 4.5 |
Dielectric Constant (@10GHz) | <3.5 | <3.5 | <3.5 | <3.5 |
Potential Application | TFT Substrate | Cover Window | TSP Substrate | FPCB |
Kolon's CPI™ with Hardcoating
High Flexibility Type – 1-Side H/C (50/10) | High Flexibility Type – Both-Side H/C (10/50/5) | High Hardness Type – 1-Side H/C (5-/20) | |
---|---|---|---|
CPI Fill Thickness (μm) | 50 | 50 | 50 |
Hard Coating Thickness (μm) | 10 | 10 / 5 | 20 |
Transmittance (%) | 91.0 | 91.0 | 91.0 |
Yellow Index | 0.6 | 1.6 | 0.6 |
Surface Hardness (750gf) | 7H | 7H | 8H |
Adhesion (Cross Cut Test) | 100/100 | 100/100 | 100/100 |
Scratch Text (#0000, 1kg, 500Times) | PASS | PASS | PASS |
Static In Folding Radius (mm) | 1 | 2 | 1 |
Static Out Folding Radius (mm) | 2 | 2.5 | 3 |
Dynamic Folding Test | Both-Side (3R x 150,000) |
Both-Side (3R x 150,000) |
Coating-Side (3R x 150,000) |
Kolon's CPI™ Varnish
Grade 5 | Grade 6 | |
---|---|---|
Solid Content (wt%) | 13~14 | 12~15 |
Solid Viscosity (ps) | 50~100 | 50~100 |
Thickness (μm) | 10 | 10 |
Yellow Index | 12.0 | 6.3 |
Transmittance (%) (@550nm) | 86.4 | 88.2 |
Rth(nm) | – | 102 |
Tg (°C) | 385 | 320 |
Td 1% (°C) | 527 | 396 |
CTE(ppm/°C)(1st/2nd Value | 6.3/7.9 (@50~380°C) | 26.9/35.1 (@50~250°C) |
Tensile Strength (MPa) | 225 | 147 |
Elongation (%) | 20.7 | 8.5 |
Modulus (GPa) | 5.4 | 5.2 |
Chemical Resistance (DMAc, NMP) | 0 | 0 |
Potential Application | TFT Substrate | TSP Substrate |
What will you make with Kolon CPI™ films?


Manufacture the films as part of a joint venture with Kolon

Let’s discuss the possibilities
Colorless Polyimide Films, or to discuss further R&D with Kolon.
This technology (KL-0001) is owned by Kolon Industries, Inc. with intellectual property management and marketing support from Fuentek, LLC.